Inhouse product
Adopts high-quality 3D NAND wafer level chip.
Supports PCIe3.0 x4 and NVMe 1.3 protocol.
All-metal cooling plate is included; equipped with intelligent temperature control technology.
Adopts TRIM to improve read/write performance and speed.
Supports Max. Write technology for full-disk SLC cache.
Supports LDPC ECC to enhance data reliability.
Low power consumption management.